Thermal Release Tape Market Development Overview.

1. Product introduction

Thermal peeling tape, also known as thermal peeling film, is made of a special adhesive that has adhesive force at room temperature. When heated to a suitable temperature, the viscosity will disappear, so that the processed parts can be simply peeled off. Automation has been implemented in various manufacturing processes of electronic products, saving manpower and improving efficiency.

2. product structure

3. Applications:

Thermal peeling tape has a wide range of applications: delicate and fragile wafer processing; cutting and positioning in the MLCC chip capacitor and chip inductor manufacturing process; semiconductor wafer surface processing; electronic and optoelectronic industry component manufacturing and processing engineering; LCD and TP touch panels Glass thinning, grinding and polishing; LED cutting, grinding and polishing; sapphire substrate thinning and grinding process; substrate graphene (Graphene) transfer and carbon nanotube transfer.